Dear Sir/Madam,
We are Chipbond Technology (Chipbond Technology).
For a long time, your department has been highly recognized by the industry for its achievements in cultivating professional talent.
As the world’s largest LCD driver IC packaging and testing service provider, Chipbond Technology has been committed to providing students with opportunities to integrate theory and practice.
Entering 2026 , we have officially launched the “Chipbond AI First Year” initiative, and we sincerely invite students from your department to participate in this year’s internship program and grow together with us.
The following are the key details of this internship program:
· Company Overview: Chipbond Technology was established in 1997 , ranks 11th globally in SATS (Semiconductor Assembly and Test Services), and holds the world’s leading position in LCD driver IC bumping, testing, and packaging .
· Open Positions:
o Engineering: Internships in facilities, equipment, process, and quality assurance .
o Technical: Production technology interns.
· Internship Locations: Hsinchu Science Park and Hukou Plant .
· Compensation & Benefits:
o Salary: Starting from NTD 33,000 per month for engineering positions and NTD 30,000 per month for technical positions, with additional shift allowances and bonus programs .
o Comprehensive Benefits: Air-conditioned dormitories (subsidies for non-local employees), staff cafeteria (free late-night meals for night shifts), a 24-hour fitness center, health check-ups, and group insurance .
o Training & Development: Comprehensive training programs, AI series courses, and dedicated mentorship and support systems .
Attachment Description: Attached is the “2026 Internship Program Presentation,” which includes detailed job descriptions, responsibilities, various bonus schemes (such as retention bonuses), and a comprehensive benefits package for your reference.
We would greatly appreciate it if your department could help forward this recruitment information to your students or post it on your departmental bulletin board. If you have any questions regarding the program, please feel free to contact us at any time.
Best Regards,
Pei-Chen Ruan Sylvia Ruan
Chipbond Technology Corporation
Recruitment Department
TEL: 03-5678788 ext 22406